Semiconductor module

A semiconductor module comprising:

• a main circuit portion in which semiconductor chips are arrayed and arranged along a first direction, each of the semiconductor chips including transistor portions and diode portions and having a gate electrode pad and a main electrode provided on an upper surface thereof, wherein the main electrode extends over the transistor portions and the diode portions thereof;
• a plurality of circuit electrodes connected to the main electrodes of a plurality of the semiconductor chips;
• a plurality of main terminals connected to the plurality of circuit electrodes;
• and
• a plurality of wires connecting the main electrodes of the plurality of the semiconductor chips and the plurality of circuit electrodes to each other, wherein
• in each of the semiconductor chips, the transistor portions and the diode portions have longitudinal sides in a second direction, and also the transistor portions and the diode portions are alternately arranged in a third direction perpendicular to the second direction,
• each of the semiconductor chips has a plurality of end sides including a gate-side end side with a closest distance to the gate electrode pad in a top view,
• the gate-side end side of each of the semiconductor chips is arranged facing a same side in a top view,
• the plurality of main terminals are arranged on a main terminal side in relation to the main circuit portion so as not to sandwich the main circuit portion in a top view,
• each of the plurality of wires has a bonding portion connected to the main electrode of a corresponding one of the plurality of the semiconductor chips,
• each of the bonding portions has a longitudinal direction in a top view,
• the longitudinal direction of the bonding portion has an angle in relation to the second direction, and
• each of the bonding portions overlaps at least a part of one of the transistor portions and at least a part of one of the diode portions in a top view.