Semiconductor package with side wall interconnection
AssigneeAvago Technologies International Sales Pte. Limited
InventorsSam Karikalan, Sam Zhao, Mayank Mayukh, Liming Tsau, Dharmendra Saraswat, Arun Ramakrishnan, Reza Sharifi
Life of this patent
Estimating the term…
Abstract
Tools and techniques for a semiconductor package providing side wall interconnections are provided. An apparatus includes two or more die layers that are bonded together, the first 3D stacked die package comprising a top surface, bottom surface, and one or more side walls. A first side wall of the one or more side walls includes two or more side wall pads, wherein each side wall pad of the two or more side wall pads is coupled to an interconnect of a respective die layer of the two or more die layers.
Claims20
An apparatus comprising:
- two or more die layers that are bonded together, the two or more die layers comprising a top surface, bottom surface, and one or more side walls,
- wherein a first side wall of the one or more side walls comprises two or more side wall pads, wherein each side wall pad of the two or more side wall pads is coupled to an interconnect of a respective die layer of the two or more die layers.
A semiconductor device comprising:
- a first three-dimensional (3D) stacked die package, wherein the first 3D stacked die package includes two or more die layers that are bonded together, the first 3D stacked die package comprising a top surface, bottom surface, and one or more side walls,
- wherein a first side wall of the one or more side walls comprises two or more side wall pads, wherein each side wall pad of the two or more side wall pads is coupled to an interconnect of a respective die layer of the two or more die layers.
A method comprising:
- stacking two or more die layers, each of the two or more die layers comprising at least one side wall pad respectively;
- bonding the two or more die layers to form a three-dimensional (3D) stacked die package, the 3D stacked die package comprising a top surface, bottom surface, and one or more side walls;
- and
- exposing each of the at least one side wall pad of the two or more die layers, at at least one side wall of the one or more side walls, wherein the exposing each of the at least one side wall pad includes making each of the at least one side wall pads accessible from an exterior of the 3D stacked die package.
Dependencies are inferred from the claim text.