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US 12,593,721 B2Granted
Internal thermal transfer for memory device
AssigneeSanDisk Technologies LLC
InventorJohn Burke
Life of this patent
Estimating the term…
Abstract
Apparatuses, systems, and methods are presented for data storage with internal thermal transfer. A plurality of memory elements may be disposed within a thermally conductive housing. A controller may be disposed within the housing and thermally connected to the housing. A heat spreader may be thermally connected to the housing and to the plurality of memory elements, and not thermally connected to the controller.
Claims20
An apparatus, comprising:
- a thermally conductive housing;
- a controller disposed within a first area of the thermally conductive housing, the first area of the thermally conductive housing comprising:
- a first thermal interface material (TIM) thermally connecting the controller to the thermally conductive housing;
- a plurality of memory elements disposed within a second area of the thermally conductive housing, the second area of the thermally conductive housing comprising:
- a heat spreader positioned between the plurality of memory elements and the second area of the thermally conductive housing;
- and
- a second TIM positioned between the heat spreader and the second area of the thermally conductive housing and thermally connecting the plurality of memory elements to the thermally conductive housing such that during operation of the controller and the memory elements, at least a portion of the thermally conductive housing proximate to the controller is hotter than the memory elements.
4 more elements
An apparatus, comprising:
- means for housing a controller and memory elements;
- means for separately thermally connecting the controller and the memory elements to the means for housing;
- and
- means for distributing heat among the memory elements, wherein the means for distributing heat among the memory elements is located between the memory elements and the means for housing to thermally connect the means for housing to the memory elements, such that during operation of the controller and the memory elements, at least a portion of the means for housing proximate to the controller is hotter than the memory elements.
1 more element
An apparatus, comprising:
- a thermally conductive housing;
- a controller disposed within a first area of the thermally conductive housing, the first area of the thermally conductive housing comprising:
- a first thermal interface material (TIM) directly connecting the controller to the thermally conductive housing;
- a plurality of memory elements disposed within a second area of the thermally conductive housing, the second area of the thermally conductive housing comprising:
- a heat spreader positioned between the plurality of memory elements and the second area of the thermally conductive housing and defining a thermal break between the first area of the thermally conductive housing and the second area of the thermally conductive housing;
- and
- a second TIM positioned between the heat spreader and the second area of the thermally conductive housing and thermally connecting the plurality of memory elements to the thermally conductive housing.
4 more elements
Dependencies are inferred from the claim text.