Back to results
US 12,593,719 B2Granted
Apparatus including integrated segments and methods of manufacturing the same
AssigneeMicron Technology, Inc.
InventorsWei Zhou, Chien Wen Huang
Life of this patent
Estimating the term…
Abstract
Semiconductor devices including one or more interfacing segments patterned within an outer protective layer and associated systems and methods are disclosed herein. The one or more interfacing segments may provide attachment interfaces/surfaces for connection pads. The one or more interfacing segments or a portion thereof may remain uncovered or exposed and provide warpage control for the corresponding semiconductor device.
Claims20
An apparatus, comprising:
- a substrate;
- a protection layer over a surface of the substrate;
- and
- an interfacing segment patterned within the protection layer, wherein:
- the interfacing segment has a bottom surface that is above the substrate,
- the interfacing segment and the protection layer include different material, and
- the interfacing segment and the protection layer are coplanar with each other.
4 more elements
A device, comprising:
- a substrate;
- active circuitry formed on the substrate;
- a protection layer over a surface of the substrate;
- and
- an interfacing segment patterned within the protection layer, wherein:
- the interfacing segment has a bottom surface that is above the substrate,
- the interfacing segment and the protection layer include different material, and
- the interfacing segment and the protection layer are coplanar with each other;
- an electrical pad physically coupled to the substrate and electrically coupled to the active circuitry;
- and
- a thermal pad physically coupled to the interfacing segment and electrically isolated from the active circuitry, wherein the thermal pad is configured to provide an external thermal interface for removing thermal energy from the device.
8 more elements
A system, comprising:
- an external device coupled to an external electrical interface;
- and
- an assembly comprising:
- a substrate;
- active circuitry formed on the substrate, the active circuitry coupled to the external electrical interface;
- a protection layer over a surface of the substrate;
- and
- an interfacing segment patterned within the protection layer, wherein:
- the interfacing segment has a bottom surface that is above the substrate,
- the interfacing segment and the protection layer include different material, and
- the interfacing segment and the protection layer are coplanar with each other;
- and
- an electrical pad physically coupled to the substrate and electrically coupled to the active circuitry, wherein the electrical pad is configured to provide the external electrical interface between the active circuitry and the external device.
10 more elements
Dependencies are inferred from the claim text.