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US 12,593,718 B2Granted
Memory system package structure and manufacturing method thereof
AssigneeYangtze Memory Technologies Co., Ltd.
InventorsXinru Zeng, Zhen Xu, Weisong Qian, Peng Chen
Life of this patent
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Abstract
A memory system package structure and a manufacturing method thereof are disclosed. For example, the memory system package structure can include a memory chip, a memory controller and a distribution layer. The memory chip can include a first surface. The memory controller can be positioned on the first surface. The redistribution layer can be positioned on a side of the memory controller facing away from the memory chip. The memory chip and the memory controller can be electrically connected with the redistribution layer.
Claims15
A memory system package structure, comprising:
- a memory chip including a first surface and a second surface opposite to the first surface;
- an electromagnetic shielding layer positioned on the second surface of the memory chip;
- a memory controller positioned on the first surface;
- and
- a redistribution layer positioned on a side of the memory controller facing away from the memory chip, the memory chip and the memory controller being electrically connected with the redistribution layer,
- wherein the memory chip further includes a plastic packaging layer that is positioned on the side of the memory controller facing away from the memory chip and covers sides of the memory controller, sides of the memory chip and the first surface of the memory chip in a direction towards the first surface of the memory chip,
- the redistribution layer is positioned on a side of the plastic packaging layer facing away from the first surface of the memory chip, and
- the electromagnetic shielding layer covers at least sides of the plastic packaging layer in the direction towards the first surface of the memory chip.
5 more elements
Dependencies are inferred from the claim text.