Substrate assembly and electronic device including the same
AssigneeInnolux Corporation
InventorsMaggy Hsu, Pierre Chen
Life of this patent
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Abstract
A substrate assembly and an electronic device are provided. The substrate assembly includes a substrate, a first metal layer, a second metal layer, a first conductive layer, and an insulating layer. The first metal layer is disposed on the substrate. The second metal layer is disposed on the substrate. The first conductive layer is disposed between the first metal layer and the second metal layer, wherein the first conductive layer overlaps with a part of the first metal layer and overlaps a part of the second metal layer. The insulating layer is disposed between the first metal layer and the second metal layer and has an opening through which the part of the first metal layer and the second metal layer are electrically connected with each other.
Claims8
A substrate assembly, comprising:
- a substrate;
- a first metal layer disposed on the substrate;
- a second metal layer disposed on the substrate;
- a first conductive layer disposed between the first metal layer and the second metal layer, wherein the first conductive layer overlaps with a part of the first metal layer and overlaps a part of the second metal layer;
- an insulating layer disposed between the first metal layer and the second metal layer, having an opening through which the first metal layer and the second metal layer are electrically connected with each other;
- a pixel unit disposed on the substrate;
- and
- a signal line disposed on the substrate and electrically connected to the pixel unit.
Dependencies are inferred from the claim text.