Substrate(s) for an integrated circuit (IC) package employing a core layer and an adjacent insulation layer(s) with an embedded metal structure(s) positioned from the core layer

A method for fabricating a substrate, comprising:

• forming a first core layer extending in a first direction, the first core layer comprising:
• a glass material;
• a first surface;
• and
• a second surface opposite the first surface in a second direction orthogonal to the first direction;
• forming a first metallization layer adjacent to the first surface, the first metallization layer comprising:
• a first insulation layer;
• and
• a first metal structure embedded in the first insulation layer;
• coupling the first metallization layer to the first core layer, the first metal structure having a third surface, the third surface positioned at least a length (l) in the second direction from the first surface of the first core layer;
• forming a second insulation layer adjacent to the second surface of the first core layer;
• forming a second metallization layer adjacent to the second insulation layer and comprising a second metal structure adjacent to the second insulation layer and positioned at least a length (t) in the second direction from the second surface of the first core layer;
• and
• coupling a metal via between the second metal structure to the first metal structure through the first insulation layer, the second insulation layer, and the first core layer.