Semiconductor package including stacked semiconductor devices and method of manufacturing the semiconductor package
AssigneeSamsung Electronics Co., Ltd.
InventorHyunsu Kim
Life of this patent
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Abstract
A semiconductor package includes a first package substrate. A first semiconductor device is mounted on an upper surface of the first package substrate. A first molding is disposed on the first package substrate and covers the first semiconductor device. A second package substrate is disposed on the first molding. At least one second semiconductor device is mounted on an upper surface of the second package substrate. A second molding covers the second semiconductor device. The second molding has a marking pattern in the first region. The second molding has an uneven structure having a plurality of trenches that define a plurality of column structures protruding from a second region on the second semiconductor device.
Claims19
A method of manufacturing a semiconductor package, comprising:
- sequentially disposing a first semiconductor device and an interposer on a first package substrate;
- disposing a second package substrate on the interposer via conductive bumps;
- disposing a second semiconductor device on the second package substrate and forming a molding covering the second semiconductor device;
- forming a marking pattern by a first laser beam on a first region of an upper surface of the molding;
- and
- forming an uneven structure by a second laser beam on a second region of the upper surface of the molding.
A method of manufacturing a semiconductor package, comprising:
- disposing an interposer on a first package substrate on which a first semiconductor device is stacked;
- disposing a second package substrate on which a second semiconductor device is stacked, on the interposer;
- forming a molding on the second package substrate covering the second semiconductor device;
- forming a marking pattern by a first laser beam having a first intensity on a first region of an upper surface of the molding;
- and
- forming an uneven structure by a second laser beam, having a second intensity that is greater than the first intensity, on a second region of the upper surface of the molding.
Dependencies are inferred from the claim text.