US 12,593,703 B2Granted

Molded bridge with vertical interconnects and method of making the same

AssigneeDeca Technologies USA, Inc.

InventorsCraig Bishop, Paul R. Hoffman

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Abstract

An electronic assembly with a molded bridge, vertical interconnects and encapsulant disposed around vertical interconnects. A first build-up interconnect structure disposed over the encapsulant and the vertical interconnects, through conductive interconnects disposed in a periphery of the molded bridge, a second encapsulant disposed over the molded bridge and around the through conductive interconnects. A second build-up interconnect structure disposed over the molded bridge, the second encapsulant, and the through conductive interconnects. To make the assembly, a first encapsulant is disposed around and over vertical interconnects disposed over a carrier, a first build-up interconnect structure is formed over the first encapsulant and the vertical interconnects, and through conductive interconnects are disposed in a periphery of the vertical interconnects. A second encapsulant is disposed over the first encapsulant, the vertical interconnects and through conductive interconnects to form a molded base, and a second build-up interconnect structure is formed over the molded base.

Claims21

Dependent claims

An electronic assembly comprising:

a molded bridge comprising a first encapsulant and a first build-up interconnect structure disposed over and coupled to the first encapsulant, wherein the first build-up interconnect structure comprises a plurality of dielectric layers interleaved with one or more conductive routing layers;
through conductive interconnects offset from at least one edge of the molded bridge;
a second encapsulant disposed over the molded bridge and around the through conductive interconnects to form a molded base, wherein the second encapsulant further comprises an encapsulant margin of the second encapsulant disposed around a perimeter of the first build-up interconnect structure and laterally disposed between edges of the molded bridge and the through conductive interconnects;
a second build-up interconnect structure comprising redistribution layers (RDLs) disposed over the second encapsulant to form a molded interposer, wherein a footprint of the second build-up interconnect structure is larger than, and includes all of, a footprint of the first build-up interconnect structure;
a first device disposed over the second build-up interconnect structure, wherein a footprint of the first device is partially over the molded bridge and partially over the through conductive interconnects;
and
a second device disposed over the second build-up interconnect structure, wherein a footprint of the second device is partially over the molded bridge and partially over the through conductive interconnects.

4 more elements

An electronic assembly comprising:

a molded bridge comprising:
an embedded component disposed within a first encapsulant;
vertical interconnects disposed within the first encapsulant and around the embedded component;
electrical interconnect structures disposed within the first encapsulant and over the embedded component and electrically coupled to the embedded component;
a first build-up interconnect structure disposed over the first encapsulant and within a second encapsulant, the first build-up interconnect structure comprising one or more first dielectric layers interleaved with one or more first conductive layers;
a second build-up interconnect structure disposed over the first build-up interconnect structure, over the first encapsulant and within a third encapsulant, the second build-up interconnect structure comprising one or more second dielectric layers interleaved with one or more second conductive layers;
and
a plurality of devices disposed over the second build-up interconnect structure.

5 more elements

Dependencies are inferred from the claim text.

Facts

Application: 19/218,116Filed 23 May 2025 · us provisional application
Priority: 12 Jun 2024
Published: US 2025/0385186 A118 Dec 2025
Granted: 31 Mar 2026
Term ends: Not estimatedThe source records don’t support an estimate.

Classification5 codes

H10W 70/611
Insulating or insulated package substrates; Interposers; Redistribution layers: for connecting multiple chips together
H10W 70/05
Manufacture or treatment: of insulating or insulated package substrates, or of interposers, or of redistribution layers
H10W 70/685
Shapes or dispositions thereof: comprising multiple insulating layers
H10W 74/111
Characterised by their shape or disposition: the semiconductor body being completely enclosed