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US 12,593,699 B2Granted
Package structure
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChung-Yi Hsu, Kai-Chiang Wu, Yen-Ping Wang
Life of this patent
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Abstract
Provided is a package structure and a method of forming the same. The package structure includes a semiconductor package, a stacked patch antenna structure, and a plurality of conductive connectors. The semiconductor package includes a die. The stacked patch antenna structure is disposed on the semiconductor package, and separated from the semiconductor package by an air cavity. The plurality of conductive connectors is disposed in the air cavity between the semiconductor package and the stacked patch antenna structure to connect the semiconductor package and the stacked patch antenna structure.
Claims20
A package structure, comprising:
- a semiconductor package comprising:
- patch antennas;
- a redistribution structure;
- a semiconductor die disposed on and electrically connected to the redistribution structure;
- a first encapsulant laterally encapsulating the semiconductor die;
- conductive vias disposed on and electrically connected to the redistribution structure, wherein the conductive vias and the semiconductor die are disposed on opposite sides of the redistribution structure respectively;
- a second encapsulant disposed on the redistribution structure and laterally encapsulating the conductive vias, wherein the redistribution structure comprises a polymer layer and a topmost conductive layer adjacent to a bottom surface of the second encapsulant, and wherein the topmost conductive layer is spaced apart from the bottom surface of the second encapsulant by the polymer layer, the topmost conductive layer comprises ground planes corresponding the patch antennas, and the patch antennas have a vertical projection that falls within a range of a vertical projection of a corresponding ground plane among the ground planes;
- a stacked patch antenna structure disposed on the second encapsulant of the semiconductor package;
- and
- conductive connectors disposed between the semiconductor package and the stacked patch antenna structure to connect the semiconductor package and the stacked patch antenna structure, wherein portions of conductive vias are electrically connected to the conductive connectors.
7 more elements
A package structure, comprising:
- a semiconductor package comprising:
- a die laterally encapsulated by a first encapsulant;
- a first redistribution structure disposed on and electrically connected to the die;
- a second redistribution structure, wherein the first redistribution structure and the second redistribution structure are disposed on opposite sides of the die;
- conductive vias laterally encapsulated by a second encapsulant, wherein the conductive vias and the second encapsulant are disposed on the second redistribution structure, and the second encapsulant is spaced apart from the first encapsulant by the second redistribution structure;
- a first stacked patch antenna structure disposed on the semiconductor package, wherein the first stacked patch antenna structure comprises:
- a substrate comprising a dielectric material with low permittivity (Dk) and low loss tangent (Df) properties;
- lower patch antennas;
- and
- upper patch antennas, wherein the lower patch antennas and the upper patch antennas are disposed on opposite sides of the substrate, the lower patch antennas are disposed adjacent to the semiconductor package, and the upper patch antennas are disposed corresponding to the lower patch antennas respectively;
- and
- conductive connectors disposed between the semiconductor package and the first stacked patch antenna structure to connect the semiconductor package and the first stacked patch antenna structure, wherein portions of the conductive vias are electrically connected to the conductive connectors and the second redistribution structure.
9 more elements
A structure, comprising:
- a semiconductor package comprising:
- a redistribution structure comprising a polymer layer and a ground plane;
- a semiconductor die disposed on and electrically connected to the redistribution structure;
- a first encapsulant laterally encapsulating the semiconductor die;
- a second encapsulant disposed on the redistribution structure, wherein the semiconductor die is spaced apart from the second encapsulant by the redistribution structure;
- a patch antenna embedded in the second encapsulant, wherein the ground planes are spaced apart from the second encapsulant by the polymer layer, and the patch antenna has a vertical projection that falls within a range of a vertical projection of the ground plane;
- conductive vias penetrating through the second encapsulant and electrically connected to the redistribution structure;
- and
- a first stacked patch antenna structure disposed on and electrically connected to the conductive vias.
6 more elements
Dependencies are inferred from the claim text.