Chip on film package and display device including the same
AssigneeLx Semicon Co., Ltd.
InventorsDam Ha, Kyung Hyun Kim
Life of this patent
Estimating the term…
Abstract
A chip on film package according to one embodiment of the present disclosure includes: a base film; a wiring unit located on the base film; a semiconductor chip mounted on the wiring unit; a first heat dissipation unit configured to come into contact with the semiconductor chip; a second heat dissipation unit configured to come into contact with the first heat dissipation unit, and comprise a metal; and an adhesive unit configured to attach the base film on which the wiring unit is located and the semiconductor chip is mounted to the second heat dissipation unit with the first heat dissipation unit therebetween.
Claims19
A chip on film package comprising:
- a base film;
- a wiring unit located on the base film;
- a semiconductor chip mounted on the wiring unit;
- a first heat dissipation unit configured to come into contact with an upper surface of the semiconductor chip;
- a second heat dissipation unit configured to come into contact with the first heat dissipation unit, and comprise a metal;
- and
- an adhesive unit configured to attach the base film on which the wiring unit is located and the semiconductor chip is mounted to the second heat dissipation unit with the first heat dissipation unit therebetween,
- wherein the first heat dissipation unit is configured to be in contact with the adhesive unit via a side surface of the semiconductor chip.
A display device comprising a chip on film package electrically connected to a display panel,
- wherein the chip on film package includes:
- a base film;
- a wiring unit located on the base film;
- a semiconductor chip mounted on the wiring unit;
- a first heat dissipation unit configured to come into contact with an upper surface of the semiconductor chip;
- a second heat dissipation unit configured to come into contact with the first heat dissipation unit, and comprising a metal;
- and
- an adhesive unit configured to attach the base film on which the wiring unit is located and the semiconductor chip is mounted to the second heat dissipation unit with the first heat dissipation unit therebetween,
- wherein the first heat dissipation unit is configured to be in contact with the adhesive unit via a side surface of the semiconductor chip.
Dependencies are inferred from the claim text.