# US 12,593,694 B2 · Electronic package and substrate structure thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,593,694 B2 - Document ID: US12593694B2 - Status: Granted - Kind: B2 - Application number: 17/893,599 - Filed: 2022-08-23 - Published: 2023-08-10 - Granted: 2026-03-31 - Earliest claimed: 2022-02-09 - Assignees: Siliconware Precision Industries Co., Ltd. - Applicants: Siliconware Precision Industries Co., Ltd. - Inventors: Hsiu-Fang Chien; Wen-Chen Hsieh; Chia-Wen Tsao; Hsin-Yin Chang; Ya-Ting Chi; Yi-Lin Tsai - Web page: https://patentgrep.com/patent/US12593694B2 ## CPC - H10W 42/121: {protecting against mechanical damage (H10W76/00, H10W74/00 take precedence)} - H10W 72/072: {of bump connectors} - H10W 72/90: Bond pads, in general - H10W 70/65: Shapes or dispositions of interconnections - H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps - H10W 72/30: Die-attach connectors - H10W 72/851: {Dispositions of multiple connectors or interconnections} - H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract An electronic package is provided and includes a substrate structure and an electronic element disposed on the substrate structure. The substrate structure is provided with a plurality of circuits and a reinforcing portion that is free from being electrically connected to the plurality of circuits on a surface of a substrate body of the substrate structure, such that the electronic element is electrically connected to the plurality of circuits and is free from being electrically connected to the reinforcing portion, and the reinforcing portion includes a dummy pad and a trace line connected to the dummy pad to increase a layout area of the reinforcing portion on the substrate body. Therefore, the adhesion of the reinforcing portion can be improved, and the electronic element can be prevented from cracking. ## Claims ### Claim 1 A substrate structure, comprising: a substrate body provided with a plurality of circuits on a surface thereof; and a reinforcing portion disposed on the surface of the substrate body and free from being electrically connected to the plurality of circuits, wherein the reinforcing portion comprises at least one dummy pad directly formed on the surface of the substrate body and at least one trace line connected to the at least one dummy pad, and the at least one dummy pad and the at least one trace line are in direct contact with the surface of the substrate body simultaneously. ### Claim 2 (depends on 1) The substrate structure of claim 1, wherein the surface of the substrate body is defined with a die placement area and a layout area surrounding the die placement area. ### Claim 3 (depends on 2) The substrate structure of claim 2, wherein the at least one dummy pad is disposed at a corner of the die placement area. ### Claim 4 (depends on 2) The substrate structure of claim 2, wherein an area of the reinforcing portion arranged on the die placement area of the surface of the substrate body is greater than or equal to 3500 μm2. ### Claim 5 (depends on 1) The substrate structure of claim 1, wherein the reinforcing portion is made of metal. ### Claim 6 (depends on 1) The substrate structure of claim 1, wherein the at least one trace line is of a straight line shape. ### Claim 7 (depends on 1) The substrate structure of claim 1, wherein the at least one trace line has at least one curved line segment. ### Claim 8 (depends on 7) The substrate structure of claim 7, wherein the at least one curved line segment is of an arc shape, a wavy shape, or a straight-angle bend shape. ### Claim 9 (depends on 7) The substrate structure of claim 7, wherein a straight line distance between opposite ends of the at least one curved line segment is 15 μm. ### Claim 10 (depends on 1) The substrate structure of claim 1, wherein an area of the reinforcing portion arranged on the surface of the substrate body is greater than or equal to 3500 μm2. ### Claim 11 (depends on 1) An electronic package, comprising: the substrate structure of claim 1; and an electronic element disposed on the surface of the substrate body and electrically connected to the plurality of circuits, wherein the electronic element is free from being electrically connected to the reinforcing portion. ### Claim 12 (depends on 11) The electronic package of claim 11, wherein the surface of the substrate body is defined with a die placement area and a layout area surrounding the die placement area, such that the electronic element is disposed on the die placement area. ### Claim 13 (depends on 12) The electronic package of claim 12, wherein the at least one dummy pad is disposed at a corner of the die placement area. ### Claim 14 (depends on 12) The electronic package of claim 12, wherein an area of the reinforcing portion arranged on the die placement area of the surface of the substrate body is greater than or equal to 3500 μm2. ### Claim 15 (depends on 11) The electronic package of claim 11, wherein the reinforcing portion is made of metal. ### Claim 16 (depends on 11) The electronic package of claim 11, wherein the at least one trace line is of a straight line shape. ### Claim 17 (depends on 11) The electronic package of claim 11, wherein the at least one trace line has at least one curved line segment. ### Claim 18 (depends on 17) The electronic package of claim 17, wherein the at least one curved line segment is of an arc shape, a wavy shape, or a straight-angle bend shape. ### Claim 19 (depends on 17) The electronic package of claim 17, wherein a straight line distance between opposite ends of the at least one curved line segment is 15 μm. ### Claim 20 (depends on 11) The electronic package of claim 11, wherein an area of the reinforcing portion arranged on the surface of the substrate body is greater than or equal to 3500 μm2.