Package lid with a vapor chamber base having an angled portion and methods for forming the same

A method of cooling a semiconductor device including a system board, an integrated circuit (IC) device on the system board, and a semiconductor package on the system board adjacent to the IC device, the semiconductor package including a package lid having a vapor chamber base with a plate portion and an angled portion extending at an angle from opposing ends of the plate portion, the vapor chamber base further including an enhancement surface, the method comprising:

• locating the semiconductor package on the system board adjacent to the IC device;
• transferring heat from a die module in the semiconductor package to the vapor chamber base of the package lid, wherein the enhancement surface on the plate portion and the angled portion enhances heat distribution over the die module by providing an uneven upper surface to increase heat dissipation efficiency;
• and
• dissipating heat from the enhancement surface on the plate portion and the angled portion of the vapor chamber base.

A method of cooling a semiconductor device including a system board, an integrated circuit (IC) device on the system board, and a semiconductor package on the system board adjacent to the IC device, the semiconductor package including a package lid having a vapor chamber base with a plate portion and an angled portion extending at an angle from opposing ends of the plate portion, the vapor chamber base including a vapor base enclosure with a vapor chamber base wick structure, the method comprising:

• locating the semiconductor package on the system board adjacent to the IC device;
• transferring heat from a die module in the semiconductor package to the vapor chamber base of the package lid, wherein the vapor chamber base wick structure within the plate portion and the angled portion facilitates capillary action to enhance heat distribution over the die module;
• and
• dissipating heat from the vapor chamber base wick structure within the plate portion and the angled portion of the vapor chamber base.