Systems and methods for cooling electronic circuits

An apparatus, comprising:

• a boilerplate comprising a plurality of sections defined by a plurality of grooves each surrounding a respective section;
• and
• a plurality of gaskets positioned in the plurality of grooves,
• wherein the boilerplate with the plurality of gaskets is configured to be coupled to a printed circuit board (PCB) comprising a plurality of groups of integrated circuit (IC) chips mounted thereon,
• wherein a thermal interface material (TIM) is placed between the boilerplate and boilerplate-facing surfaces of IC chips in the plurality of groups of IC chips, and
• wherein each of the plurality of sections of the boilerplate is configured to accommodate a respective group of the plurality of groups of IC chips, and the plurality of gaskets are configured to seal the plurality of groups of IC chips when the boilerplate is coupled to the PCB.

An apparatus, comprising:

• a boilerplate comprising:
• a plurality of rails aligned in parallel with one another, with intervening grooves separating adjacent rails;
• and
• one or more gaskets positioned in the intervening grooves;
• a printed circuit board (PCB) comprising a plurality of integrated circuit (IC) chips mounted thereon, wherein the boilerplate with the one or more gaskets is configured to be coupled to the PCB;
• and
• a thermal interface material (TIM) placed between the boilerplate and surfaces of the plurality of IC chips that face the boilerplate,
• wherein the one or more gaskets are configured to seal the plurality of the IC chips with the TIM placed between the boilerplate and the surfaces of the plurality of the IC chips when the boilerplate with the one or more gaskets is coupled to the PCB.