Semiconductor package

A semiconductor package, comprising:

• a connection structure having first and second surfaces opposing each other and including a first redistribution layer, the second surface divided into a first region and a second region;
• a semiconductor chip disposed on the first surface of the connection structure and including connection pads connected to the first redistribution layer;
• an encapsulant disposed on the first surface of the connection structure and encapsulating the semiconductor chip;
• a second redistribution layer disposed on the encapsulant;
• a wiring structure connecting the first and second redistribution layers to each other and extending in a stacking direction;
• and
• a heat dissipation element disposed on the first region of the second surface of the connection structure;
• an adhesive layer attaching the heat dissipation element to the connection structure;
• and
• at least one surface-mount component disposed on the second region of the connection structure and connected to the first redistribution layer.

A semiconductor package, comprising:

• a connection structure having first and second surfaces opposing each other and including an insulating layer and a first redistribution layer on the insulating layer;
• a semiconductor chip disposed on the connection structure and having an active surface facing the first surface of the connection structure, and connection pads arranged on the active surface, the connection pads connected to the first redistribution layer;
• an encapsulant disposed on the first surface of the connection structure and encapsulating the semiconductor chip;
• a second redistribution layer disposed on the encapsulant;
• a wiring structure connecting the first and second redistribution layers to each other and extending in a stacking direction;
• a heat dissipation element disposed on an entire area of the second surface of the connection structure;
• an adhesive layer attaching the heat dissipation element to the insulating layer of the connection structure;
• a passivation layer disposed on the encapsulant and covering the second redistribution layer;
• and
• a plurality of underbump metal layers disposed on the passivation layer and connected to the second redistribution layer.