Electronic device for detecting defect in semiconductor package and operating method thereof

An electronic device comprising:

• a first device connected to an equipment, the first device comprising a data collector configured to acquire profile data including operation information of the equipment from the equipment performing a bonding process of a semiconductor chip;
• a second device comprising a pre-processor and a defect detector, wherein the pre-processor is configured to pre-process the profile data to calculate characteristic data of bonded chips and wherein the defect detector is configured to select a defect coordinate of a defective chip on a substrate by comparing result data of a reference chip and peripheral chips based on the characteristic data after the bonding process is completed;
• and
• a main server configured to store data generated during the bonding process, wherein the result data comprises respective height value information of the bonded chips.

A server comprising:

• a memory configured to store instructions;
• and
• a processor configured to access the memory and to execute the instructions loaded into the memory, wherein the instructions, when executed by the processor, cause the processor to:
• obtain profile data including operation information of an equipment performing a bonding process of a chip from an outside device;
• calculate characteristic data of bonded chips by pre-processing the profile data;
• and
• after the bonding process is completed, select a coordinate of a defective chip on a substrate as a defect coordinate based on comparing result data of a reference chip and peripheral chips based on the characteristic data,
• wherein the result data comprises respective height value information of the bonded chips, and
• wherein each of the characteristic data comprises first information and second information, wherein the first information corresponds to a first height value of a respective chip at a moment when a header of the equipment and the respective chip are first touched, and wherein the second information corresponds to a second height value when the respective chip is pressed.