Method for manufacturing semiconductor device by removing carrier after forming re-distribution layer

A method for manufacturing a semiconductor device, comprising:

• preparing a temporary fixing structure body in which a plurality of semiconductor elements each including a first surface on which a connection terminal is formed and a second surface on a side opposite to the first surface are attached to a temporary fixing material, in the temporary fixing structure body, the plurality of semiconductor elements being attached onto the temporary fixing material such that the first surface of each of the plurality of semiconductor elements is directed toward the temporary fixing material, and the plurality of semiconductor elements being encapsulated with an encapsulant material such that the second surface of each of the plurality of semiconductor elements is exposed from an encapsulant material layer,
• forming a curable bonding adhesive layer on the second surface of each of the plurality of semiconductor elements;
• attaching a carrier to one surface of the curable bonding adhesive layer on a side opposite to the plurality of semiconductor elements;
• fixing the plurality of semiconductor elements to the carrier by curing the curable bonding adhesive layer through the cured curable bonding adhesive layer;
• removing the temporary fixing material;
• forming a re-distribution layer on the first surface of each of the plurality of semiconductor elements in a state in which the plurality of semiconductor elements are fixed to the carrier;
• and
• removing the carrier after forming the re-distribution layer, wherein the carrier is removed from the cured curable bonding adhesive layer.