System including an array of bonding heads and an array of die transfer seats and a method of using the same

Abstract

A system can include a substrate chuck, an array of M bonding heads, an array of N*M die transfer seats, and a carriage. The substrate chuck and the array of N*M die transfer seats can be positioned along the carriage. Each of N and M can be greater than 1. A method of using the system can include transferring a first set of dies from the array of N*M die transfer seats to the array of M bonding heads, bonding the first set of dies to a destination substrate, transferring a second set of dies from the array of N*M die transfer seats to the array of M bonding heads, and bonding the second set of dies to the destination substrate. In an implementation, the same carriage including die transfer seats and a substrate chuck can help to reduce movement during an alignment or bonding operation.

Dependencies are inferred from the claim text.