Payload transportation system
AssigneeTaiwan Semiconductor Manufacuturing Company, Ltd.
InventorsChieh Hsu, Guancyun Li, Ching-Jung Chang, Chi-Feng Tung
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AssigneeTaiwan Semiconductor Manufacuturing Company, Ltd.
InventorsChieh Hsu, Guancyun Li, Ching-Jung Chang, Chi-Feng Tung
Estimating the term…
System and method for cross-fab wafer transportation are provided. A method includes providing a first FAB building and a second FAB building connected via a bridging area, the second FAB building comprising fabrication tools configured to perform fabrication processes different than fabrication processes performed by fabrication tools in the first FAB building, after performing fabrication processes in the first FAB building, configuring a first vehicle of the first FAB building to travel along a first OHT track and take the wafer to the bridging area, configuring a second vehicle of the second FAB building to travel along a second OHT track and arrive at the bridging area, where a portion of the first OHT track is in parallel with a portion of the second OHT track at the bridging area, when some predetermined conditions are met, configuring the first vehicle to transfer the wafer to the second vehicle.
A system, comprising:
A system, comprising:
A method, comprising:
Dependencies are inferred from the claim text.