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US 12,593,620 B2Granted
Technologies for scalable spin qubit readout
AssigneeIntel Corporation
InventorsBishnu Prasad Patra, Stefano Pellerano, JongSeok Park
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Abstract
Technologies for scalable spin qubit readout are disclosed. In the illustrative embodiment, superconducting and semiconducting components are integrated onto a single chip, allowing for frequency and temporal multiplexing components to be integrated onto the same die. The semiconducting components on the die can include transistors, varactors, and amplifiers, and the superconducting components can include an inductor and a capacitor that form part of an impedance matching network.
Claims18
A die comprising:
- an impedance matching network comprising:
- an input;
- an output;
- a capacitor connected across the input and the output;
- and
- an inductor connected across the output and a ground,
- wherein the capacitor and the inductor are superconductors;
- and
- a plurality of transistors, wherein individual transistors of the plurality of transistors comprise an input connected to the output of the impedance matching network and an output connected to an output pad.
6 more elements
Dependencies are inferred from the claim text.