Thermoelectric devices on ceramic
AssigneeSheetak, Inc.
InventorsUttam Ghoshal, Key Kolle
Life of this patent
Estimating the term…
Abstract
The disclosure is related to structures and method of making thermoelectric devices. The structures include an electrically nonconductive and thermally conductive substrate with direct bonded or electroplated copper. Thermoelement pairs are formed on a barrier layer deposited on the outer layers of the substrate in gaps formed from insulator material deposited on the barrier layer. Openings in the barrier layer may be filled with an insulator to isolate thermoelements, which may then be bridged by a metal layer. Thermoelement pairs may be combined to form larger devices.
Claims11
A thermoelectric apparatus, the apparatus comprising:
- a first stage comprising:
- a copper substrate comprising:
- a first copper layer with an opening;
- and
- a substrate;
- wherein the first copper layer is direct bonded or electroplated onto one face of the substrate;
- a barrier layer disposed on the first copper layer with an opening coterminous with the opening in the first copper layer;
- an insulator disposed on the substrate through the opening in the first copper layer and the opening in the barrier layer and on the barrier layer to form a first insulator gap on one side of the opening in the barrier layer and a second insulator gap on other side of the opening in the barrier layer;
- an n-type thermoelectric layer disposed in the first insulator gap;
- a p-type thermoelectric layer disposed in the second insulator gap;
- a metal layer disposed on the n-type thermoelectric layer, the p-type thermoelectric layer, and on the insulator between the n-type thermoelectric layer and the p-type thermoelectric layer;
- an overcoat layer disposed on the metal layer with a gap disposed between the n-type thermoelement layer and the p-type thermoelement layer;
- a metal pad disposed in the gap and on the overcoat layer;
- a solder layer in contact with the metal pad;
- a surface layer in contact with the solder layer;
- a second copper layer disposed on the surface layer;
- and
- a second substrate disposed on the second copper layer;
- where the surface layer is made of one of TiW/Pt/Au, Ni/Au, and Ni/Pd/Au;
- and
- where the solder layer is made of one of Au/Sn, Sn—Ag—Cu, and Bi—Sn.
Dependencies are inferred from the claim text.