Metal overhang for advanced patterning

A device comprising a plurality of sub-pixels, each sub-pixel of the plurality of sub-pixels defined by adjacent pixel-defining layer (PDL) structures and adjacent metal-containing overhang structures disposed over the adjacent PDL structures, each sub-pixel having an anode, organic light-emitting diode (OLED) material disposed over the anode, a cathode disposed over the OLED material, and an encapsulation layer disposed over the cathode, wherein the device is made by a process comprising:

• depositing the OLED material using deposition over a substrate, the OLED material disposed over the anode, the OLED material having an OLED edge defined by defined by adjacent overhangs of the metal-containing overhang structures, each metal-containing overhang structure comprising a body and an extension, the body and extension formed of the same metal-containing material, the extension extending beyond a sidewall of the body to form an overhang;
• depositing the cathode using deposition, wherein the cathode contacts the sidewall of the body of the adjacent metal-containing overhang structures of a respective sub-pixel and the extension extends over a portion of the OLED material and the cathode, such that the OLED material does not contact the body and the cathode contacts the body;
• and
• depositing the encapsulation layer using deposition, the encapsulation layer disposed over the cathode and extending under each adjacent metal-containing overhang structure, along a sidewall of each adjacent metal-containing overhang structure, and over an upper surface of each adjacent metal-containing overhang structure, the encapsulation layer of each sub-pixel being discontinuous from the encapsulation layer of an adjacent sub-pixel.

A method, comprising:

• disposing a first resist in a pixel opening and over exterior portions of adjacent PDL structures, the adjacent PDL structures disposed over a substrate;
• disposing a second resist on the first resist between the exterior portions of the adjacent PDL structures;
• plating a metal-containing material over an area defined by the first resist and the second resist;
• and
• removing the second resist and the first resist to form metal-containing overhang structures disposed over the adjacent PDL structure.