Ceramic substrate with heat sink and manufacturing method thereof

A heat exchange system comprising:

• a ceramic substrate including a metal layer on at least one surface of a ceramic base;
• and
• a heat sink bonded to the one surface of the ceramic substrate and having a multi-layer structure through which refrigerant enters and exits,
• wherein the heat sink includes:
• a base layer in which an inflow hole and a discharge hole are formed;
• a flow path layer which is disposed above the base layer and on which a plurality of flow paths are disposed in a matrix;
• and
• at least one intermediate layer disposed between the base layer and the flow path layer, formed with an inflow passage connecting one end of at least one of the plurality of flow paths to the inflow hole, and formed with a discharge passage connecting the other end of at least one of the plurality of flow paths to the discharge hole,
• wherein a coefficient of thermal expansion of the at least one intermediate layer is lower than coefficients of thermal expansion of the base layer and the flow path layer, and
• wherein the overall thickness of the at least one intermediate layer is greater than a thickness of each of the base layer and the flow path layer.