Display apparatus and manufacturing method therefor, and multi-screen display apparatus using same
AssigneeLG Electronics Inc.
InventorsDongjin Yoon, Jeongsik Choi, Sangtae Park, Younhwan Shin, Kiseok Kim
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Abstract
Display device according to an embodiment of the present invention includes a substrate, a plurality of semiconductor light emitting devices formed on the upper surface of the substrate, and a coating layer formed on the substrate. The coating layer includes an encapsulation layer formed at a predetermined height from the upper surface of the substrate and covering the plurality of semiconductor light emitting devices, and a film layer formed on the upper surface of the encapsulation layer. A polishing pattern is formed on the upper surface of the encapsulation layer.
Claims6
A method of manufacturing a display device, comprising:
- transferring a plurality of semiconductor light emitting devices to an upper surface of a substrate;
- forming an encapsulation layer covering the upper surface of the substrate and the plurality of semiconductor light emitting devices;
- removing a portion of the encapsulation layer, from among a plurality of encapsulation layers, exceeding a preset height from the upper surface of the substrate;
- forming a film layer on an upper surface of the encapsulation layer;
- removing the film layer from the upper surface of the encapsulation layer;
- applying a light-transmitting encapsulant on the upper surface of the encapsulation layer, resulting in a reworked encapsulation layer;
- re-forming the reworked encapsulation layer by removing an encapsulation layer or a light-transmitting encapsulant exceeding a preset height from the upper surface of the substrate from among the encapsulation layer and the applied light-transmitting encapsulant, resulting in a re-formed encapsulation layer;
- and
- forming a second film layer on an upper surface of the re-formed encapsulation layer,
- wherein the film layer is disposed on the upper surface of the encapsulation layer to have a separation distance from the plurality of semiconductor light emitting devices,
- wherein the film layer comprises a light-transmitting adhesive film directly attached on the upper surface of the encapsulation layer, and
- wherein the encapsulation layer comprises a light-transmitting silicone or epoxy and does not comprise an adhesive film.
Dependencies are inferred from the claim text.