US 12,593,524 B2 · Semiconductor package

Abstract

A yield drop of a semiconductor package including a via is reduced. The semiconductor package includes a solid-state imaging element, a circuit layer, a wiring layer, and a support substrate. The solid-state imaging element in the semiconductor package generates image data. A signal processing circuit that performs predetermined signal processing on the image data is disposed in the circuit layer. An output side via the other end of which is connected to an external terminal penetrates the support substrate. The wiring layer is disposed between the support substrate and the circuit layer. A signal line that connects the signal processing circuit and one end of the output side via is wired in the wiring layer.

Claims21

Dependent claims

A semiconductor package, comprising:

a solid-state imaging element configured to generate image data;
a circuit layer including a signal processing circuit, wherein the signal processing circuit is configured to process the image data;
a support substrate including an output side via, wherein
the output side via penetrates through the support substrate,
the output side via includes a first end and a second end,
the first end is opposite to the second end, and
the first end of the output side via is connected to an external terminal;
a wiring layer, including a signal line, between the support substrate and the circuit layer, wherein the signal line is configured to connect the signal processing circuit and the second end of the output side via;
and
a pad inside the wiring layer, wherein the second end of the output side via is connected, via the pad, to the signal line.

7 more elements

Dependencies are inferred from the claim text.

Semiconductor package

Life of this patent

Semiconductor package

Life of this patent

Abstract

Claims21