Backside illuminated image sensor structure including light pipe structure and manufacturing method thereof
AssigneePowerchip Semiconductor Manufacturing Corporation
InventorsYu Ling Huang, Yu-Yuan Lai
Life of this patent
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Abstract
A backside illuminated image sensor structure including a pixel structure is provided. The pixel structure includes a substrate, a light sensing device, and at least one light pipe structure. The substrate includes a first surface and a second surface opposite to each other. The second surface has at least one recess. The light sensing device is located in the substrate. The light sensing device is adjacent to the first surface. The light pipe structure is located in the substrate. The light pipe structure is located directly above the light sensing device.
Claims19
A backside illuminated (BSI) image sensor structure, comprising a pixel structure, wherein the pixel structure comprises:
- a substrate comprising a first surface and a second surface opposite to each other, wherein the second surface has at least one recess;
- a light sensing device located in the substrate and adjacent to the first surface;
- and
- at least one light pipe structure located in the substrate and located directly above the light sensing device, wherein the light pipe structure comprises:
- a filling material layer located in the substrate;
- and
- a passivation layer located between the filling material layer and the substrate.
A manufacturing method of a BSI image sensor structure, comprising:
- providing a substrate, wherein the substrate comprises a first surface and a second surface opposite to each other;
- forming a light sensing device in the substrate, wherein the light sensing device is adjacent to the first surface;
- forming at least one recess on the second surface;
- and
- forming at least one light pipe structure in the substrate, wherein the light pipe structure is located directly above the light sensing device, and the light pipe structure comprises:
- a first portion of a filling material layer located in the substrate;
- and
- a first portion of a passivation layer located between the filling material layer and the substrate.
Dependencies are inferred from the claim text.