Semiconductor substrate, treating method thereof, solar cell and preparation method thereof

A method for treating a semiconductor substrate, wherein the method comprises:

• forming a smooth surface area and a textured surface area adjacent to the smooth surface area on at least one side of the semiconductor substrate;
• wherein the step of forming a smooth surface area and a textured surface area adjacent to the smooth surface area on any one side of the semiconductor substrate comprises:
• forming a protective layer on a surface of any one side of the semiconductor substrate;
• providing a patterned cover layer on a surface of the protective layer facing away from the semiconductor substrate, wherein the cover layer has a hollow area, and the protective layer comprises a first area located at the bottom of the hollow area and a second area covered by the cover layer;
• thickening the first area of the protective layer by using the cover layer;
• removing the cover layer after thickening the first area of the protective layer;
• using the first area of the protective layer after removing the cover layer as a protection, removing the second area of the protective layer by etching;
• performing a texture treatment on a side of the semiconductor substrate exposed by the protective layer after removing the second area, so that the textured surface area is formed on the side of the semiconductor substrate exposed by the protective layer;
• and
• removing the first area corresponding to the protective layer by etching after forming the textured surface area, so that the smooth surface area is formed on part of the surface on one side of the semiconductor substrate.