Back to results
US 12,593,507 B2Granted
Substrate, manufacturing method thereof, and spliced panel
AssigneeTcl China Star Optoelectronics Technology Co., Ltd.
InventorHu Wang
Life of this patent
Estimating the term…
Abstract
A substrate, a manufacturing method thereof, and a spliced panel are disclosed. A base includes a front surface, a lateral surface, and a back surface. A first conductive layer is disposed on the front surface. The first conductive layer includes a first wire. A protective layer is disposed on the first conductive layer. A conductive part is correspondingly disposed in a contact hole and is connected to the first wire. The conductive part is stacked with the first wire to form an overlapping surface. A second conductive layer is disposed on the lateral surface of the base. The second conductive layer includes a second wire. The second wire is connected to the overlapping surface.
Claims20
A substrate, comprising:
- a base, wherein the base comprises a front surface, a lateral surface, and a back surface, the front surface is disposed opposite to the back surface, and the lateral surface is disposed between the front surface and the back surface;
- a first conductive layer, wherein the first conductive layer is disposed on the front surface and comprises a plurality of first wires, and the first wires are close to the lateral surface;
- a protective layer, wherein the protective layer is disposed on the first conductive layer and is provided with a plurality of contact holes, the contact holes are close to the lateral surface, each of the contact holes exposes part of one of the first wires;
- a plurality of conductive parts, wherein each of the conductive parts is correspondingly disposed in one of the contact holes and is connected to one of the first wires, the conductive parts are stacked with the first wires to form an overlapping surface, and the overlapping surface is close to the lateral surface;
- a second conductive layer, wherein the second conductive layer is disposed on the lateral surface of the base, the second conductive layer comprises a plurality of second wires, and the second wires are connected to the overlapping surface;
- a third conductive layer, wherein the third conductive layer is disposed on the back surface of the base, the third conductive layer comprises a plurality of third wires and a plurality of conductive pads connected to the third wires, and each of the third wires is connected to one of the second wires;
- an insulating layer, wherein the insulating layer is disposed on a surface of the third conductive layer away from the base, the insulating layer is provided with a plurality of through-holes, the through-holes are close to the lateral surface, and each of the through-holes exposes part of one of the third wires;
- and
- a plurality of thickened parts, wherein the thickened parts comprise a conductive material, each of the thickened parts is correspondingly disposed in one of the through-holes and is connected to one of the third wires, the thickened parts are stacked with the third wires to form a connecting surface, and the connecting surface is close to the lateral surface;
- wherein the second wires are connected to the connecting surface.
7 more elements
A spliced panel, comprising at least two substrates spliced to each other, wherein each of the at least two substrates comprises:
- a base, wherein the base comprises a front surface, a lateral surface, and a back surface, the front surface is disposed opposite to the back surface, and the lateral surface is disposed between the front surface and the back surface;
- a first conductive layer, wherein the first conductive layer is disposed on the front surface and comprises a plurality of first wires, and the first wires are close to the lateral surface;
- a protective layer, wherein the protective layer is disposed on the first conductive layer and is provided with a plurality of contact holes, the contact holes are close to the lateral surface, each of the contact holes exposes part of one of the first wires;
- a plurality of conductive parts, wherein each of the conductive parts is correspondingly disposed in one of the contact holes and is connected to one of the first wires, the conductive parts are stacked with the first wires to form an overlapping surface, and the overlapping surface is close to the lateral surface;
- a second conductive layer, wherein the second conductive layer is disposed on the lateral surface of the base, the second conductive layer comprises a plurality of second wires, and the second wires are connected to the overlapping surface;
- a third conductive layer, wherein the third conductive layer is disposed on the back surface of the base, the third conductive layer comprises a plurality of third wires and a plurality of conductive pads connected to the third wires, and each of the third wires is connected to one of the second wires;
- an insulating layer, wherein the insulating layer is disposed on a surface of the third conductive layer away from the base, the insulating layer is provided with a plurality of through-holes, the through-holes are close to the lateral surface, and each of the through-holes exposes part one of the third wires;
- and
- a plurality of thickened parts, wherein the thickened parts comprise a conductive material, each of the thickened parts is correspondingly disposed in one of the through-holes and is connected to one of the third wires, the thickened parts are stacked with the third wires to form a connecting surface, and the connecting surface is close to the lateral surface;
- wherein the second wires are connected to the connecting surface.
7 more elements
A method of manufacturing a substrate, comprising following steps:
- providing a base, wherein the base comprises a front surface, a lateral surface, and a back surface, the front surface is disposed opposite to the back surface, and the lateral surface is disposed between the front surface and the back surface;
- forming a first conductive layer on the front surface of the base, wherein the first conductive layer comprises a plurality of first wires, and the first wires are close to the lateral surface;
- forming a protective layer on the first conductive layer, wherein the protective layer is provided with a plurality of contact holes, the contact holes are close to the lateral surface, and each of the contact holes exposes part of one of the first wires;
- forming a plurality of conductive parts on the first wires in the contact holes, wherein the conductive parts are stacked with the first wires to form an overlapping surface, and the overlapping surface is close to the lateral surface;
- and
- forming a second conductive layer on the lateral surface of the base and the overlapping surface, wherein the second conductive layer comprises a plurality of second wires, and the second wires are connected to the overlapping surface.
3 more elements
Dependencies are inferred from the claim text.