Heat dissipation device
AssigneeNational Tsinghua University
InventorShwin-Chung Wong
Life of this patent
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Abstract
A heat dissipation device is adapted for dissipating heat from a heat source, and includes a vaper chamber, a heat pipe set and a heat dissipation fin set. The vapor chamber is adapted for thermal coupling to the heat source. The heat pipe set is adapted for thermal coupling to the heat source, the heat from the heat source is synchronously conducted to the vapor chamber and the heat pipe set. The vapor chamber is thermally coupled to the heat dissipation fin set, and the heat pipe set penetrates through the heat dissipation fin set.
Claims2
A heat dissipation device, adapted to dissipate heat of a heat source, and comprising:
- a vapor chamber, adapted for thermal coupling to the heat source;
- a heat pipe set including a compressed portion adapted for thermal coupling to the heat source;
- a heat dissipation fin set, wherein the vapor chamber is thermally coupled to the heat dissipation fin set, and the heat pipe set penetrates through the heat dissipation fin set;
- and
- a heat conduction structure including a body,
- wherein the vapor chamber and the heat pipe set are in direct contact with the body such that heat from the heat source is synchronously conducted to the vapor chamber and the heat pipe set through the body,
- wherein the heat dissipation fin set directly contacts a top surface of the vapor chamber,
- wherein the vapor chamber directly contacts a top surface of the body and the compressed portion,
- wherein the compressed portion directly contacts the heat source and a side surface of the body, and
- wherein a bottom surface of the body directly contacts the heat source.
Dependencies are inferred from the claim text.