Heatsink with adjustable fin pitch
AssigneeNVIDIA Corporation
InventorsSusheela Narasimhan, Michal L. Sabotta
Life of this patent
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Abstract
An apparatus includes at least one heat pipe that is adapted to be thermally coupled to an integrated circuit and has an evaporator portion and a first condenser portion, wherein the first condenser portion extends away from the evaporator portion; a first plurality of cooling fins that is attached to the first condenser portion; a first movable support that is thermally coupled to the first condenser portion and is configured to move a second plurality of cooling fins relative to the first plurality of cooling fins; and the second plurality of cooling fins, which is attached to the first movable support.
Claims9
A method of controlling an adjustable heat sink, the method comprising:
- receiving one or more signals that indicate at least one temperature associated with at least one aspect of a computer system in which the adjustable heat sink resides;
- based on the one or more signals, determining an adjustment to be made to the adjustable heat sink, wherein the adjustment modulates a space maintained between a first plurality of stationary cooling fins and a second plurality of adjustable cooling fins when the adjustable heat sink receives airflow;
- and
- causing an actuator to perform the adjustment.
Dependencies are inferred from the claim text.