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US 12,593,413 B2Granted
Storage device having a flexible printed circuit board and an electronic component
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorsHayato Yamaguchi, Masahide Takazawa, Shinra Yamanaka, Nobuhiro Yamamoto, Taichi Okano
Life of this patent
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Abstract
A flexible printed circuit board of a storage device includes a first insulating layer, a first conductive layer on a first surface of the first insulating layer, and a second conductive layer on a second surface of the first insulating layer. The second surface is opposite the first surface. The first conductive layer is provided with a land. The second conductive layer covers the land via the first insulating layer in a first direction in which the first surface faces. An electronic component of the storage device includes a pin joined to the land.
Claims18
A storage device comprising:
- a flexible printed circuit board including
- a first insulating layer,
- a first conductive layer on a first surface of the first insulating layer, the first conductive layer being provided with at least one land, and
- a second conductive layer on a second surface of the first insulating layer, to cover the at least one land via the first insulating layer in a first direction in which the first surface faces, the second surface being opposite the first surface;
- and
- an electronic component including at least one pin joined to the at least one land, wherein
- the at least one land includes two first lands disposed at an interval in a second direction along the first surface,
- the at least one pin includes two first pins disposed and bonded to the two first lands at an interval in the second direction,
- in between the first insulating layer and the electronic component, the first conductive layer is provided with a gap between the two first lands,
- the second conductive layer is provided with two second lands disposed at an interval in the second direction and with a gap between the two second lands, and
- the two second lands cover the two first lands via the first insulating layer in the first direction.
8 more elements
A storage device comprising:
- a flexible printed circuit board including
- a first insulating layer,
- a first conductive layer on a first surface of the first insulating layer, the first conductive layer being provided with at least one land, and
- a second conductive layer on a second surface of the first insulating layer, to cover the at least one land via the first insulating layer in a first direction in which the first surface faces, the second surface being opposite the first surface;
- and
- an electronic component including at least one pin joined to the at least one land, wherein
- the at least one land includes two first lands disposed at an interval in a second direction along the first surface,
- the at least one pin includes two first pins disposed and bonded to the two first lands at an interval in the second direction,
- in between the first insulating layer and the electronic component, the first conductive layer is provided with a gap between the two first lands,
- the flexible printed circuit board further includes a second insulating layer covering the first surface,
- the second insulating layer is provided with a through-hole covered by the electronic component, and
- on a projection plane as viewed in the first direction, an end of the through-hole in a third direction is located outside the electronic component, the third direction being along the first surface and orthogonal to the second direction.
9 more elements
A storage device comprising:
- a flexible printed circuit board including
- a first insulating layer,
- a first conductive layer on a first surface of the first insulating layer, the first conductive layer being provided with at least one land, and
- a second conductive layer on a second surface of the first insulating layer, to cover the at least one land via the first insulating layer in a first direction in which the first surface faces, the second surface being opposite the first surface;
- an electronic component including at least one pin joined to the at least one land;
- and
- a wall including a third surface attached to the flexible printed circuit board, a protruding part of the wall protruding from the third surface, wherein
- the at least one land includes two first lands disposed at an interval in a second direction along the first surface,
- the at least one pin includes two first pins disposed and bonded to the two first lands at an interval in the second direction,
- in between the first insulating layer and the electronic component, the first conductive layer is provided with a gap between the two first lands,
- the flexible printed circuit board is interposed between the electronic component and the wall, and
- the protruding part covers the two first lands via the first insulating layer in the first direction.
9 more elements
Dependencies are inferred from the claim text.