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US 12,593,412 B2Granted
Electronic control device
AssigneeHitachi Astemo, Ltd.
InventorsRyujo Sugahara, Hidetatsu Yamamoto, Daisuke Tanaka, Eiji Ichikawa, Michihito Watarai, Hideyuki Sakamoto
Life of this patent
Estimating the term…
Abstract
An electronic control device includes: a first board on which a bus bridge and an external communication connector are mounted; a second board on which an accelerator SoC is mounted, the second board being electrically connected to the first board; and a B-to-B connector capable of performing signal transmission between the bus bridge and the accelerator SoC.
Claims5
An electronic control device, comprising:
- a bus bridge that is thermally coupled to a housing of the electronic control device;
- a first board on which the bus bridge and an external communication connector are mounted, wherein the external communication connector is arranged on an edge of the first board;
- a second board on which an accelerator System on a Chip (SoC) is mounted, the second board being mechanically coupled and electrically connected to the first board, wherein in a plan view the accelerator SoC is aligned with the bus bridge in a first direction when the second board is mechanically coupled to the first board;
- a first Board to Board (B-to-B) connector that transmits a signal between the bus bridge and the accelerator SoC, wherein the first B-to-B connector comprises mating connector halves mounted directly on the first board and the second board, respectively, and positioned on surfaces of the boards that face each other, and wherein in the plan view the external communication connector is aligned in a second direction with the first B-to-B connector when the second board is mechanically coupled to the first board, and the first direction and the second direction are orthogonal;
- a third board on which an image processing SoC is mounted, the third board being electrically connected to the first board;
- and
- a second B-to-B connector that transmits a signal between the bus bridge and the image processing SoC,
- wherein the external communication connector is disposed along one side edge of the first board and the bus bridge lies between the external communication connector and the second B-to-B connector, the connector half of the second B-to-B connector on the first board being disposed at an end portion of the first board on an extension of a straight line connecting the external communication connector and the bus bridge, the second B-to-B connector passing through a hole in the housing whose longitudinal direction is parallel to a longitudinal direction of the housing, and the first board and the third board are fastened to the housing at locations surrounding the second B-to-B connector to suppress displacement of the connector caused by vibration.
5 more elements
Dependencies are inferred from the claim text.