Printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJin Uk Lee, Youn Gyu Han, Jin Won Lee, Da Yeon Lee, Yong Duk Lee
Life of this patent
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Abstract
A printed circuit board includes a substrate, a first pad and a second pad, respectively disposed on an upper side of the substrate, a first socket disposed in the substrate and including a first circuit, and a first trace disposed in the substrate and disposed between the first and second pads and the first socket with respect to a lamination direction. At least a portion of the first circuit is electrically connected to each of the first and second pads, and is electrically connected to the second pad through a path passing through the first trace.
Claims26
A printed circuit board comprising:
- a substrate;
- a first pad and a second pad, respectively disposed on an upper side of the substrate;
- a first socket disposed in the substrate and including a first circuit;
- a second socket embedded in the substrate and including a second circuit;
- and
- a first trace disposed in the substrate and disposed between the first socket and at least one of the first and second pads with respect to a lamination direction of insulating layers of the substrate,
- wherein at least a portion of the first circuit is connected to each of the first and second pads, and is connected to the second pad through a path passing through the first trace.
A printed circuit board comprising:
- a substrate including insulating layers, a wiring layer, and a via layer;
- and
- a first socket embedded in the substrate and including a first circuit,
- wherein
- the via layer includes a plurality of first vias and a plurality of second vias,
- the first socket includes a plurality of first connection pads and a plurality of second connection pads,
- the plurality of first vias and the plurality of second vias contact the plurality of first connection pads and the plurality of second connection pads, respectively, and
- an average pitch between the plurality of second connection pads is greater than an average pitch between the plurality of first connection pads.
A printed circuit board comprising:
- a substrate including insulting layers;
- a plurality of pads disposed on one surface of the substrate;
- and
- a socket disposed in the substrate and including a plurality of connection pads disposed on a surface of the socket,
- wherein
- the plurality of connection pads include a first connection pad connected to a first pad of the plurality of pads through a path extending in a lamination direction of the insulating layers, and a second connection pad connected to a second pad of the plurality of pads, and
- the second connection pad is offset from the plurality of pads in the lamination direction.
Dependencies are inferred from the claim text.