Middle frame assembly, preparation method thereof, and electronic device
AssigneeHonor Device Co., Ltd.
InventorsYin Meng, Jing Gao, Cheng Jiang
Life of this patent
Estimating the term…
Abstract
Disclosed is a middle frame assembly, including a middle plate and a frame disposed around an outer edge of the middle plate, where the middle plate includes a first carbon fiber reinforced resin composite material base body and a first metal plating layer compounded on a surface of the base body. Some embodiments of this application further provide a preparation method for a middle frame assembly and an electronic device in the middle frame assembly. Some embodiments of this application use a carbon fiber reinforced resin composite material as a middle plate base body of the middle frame assembly.
Claims19
A middle frame assembly, comprising:
- a middle plate;
- and
- a frame disposed around an outer edge of the middle plate, wherein the middle plate includes a base body comprising first carbon fiber reinforced resin composite material and a first metal plating layer compounded on a surface of the base body;
- wherein a first part of the base body that is not connected to the frame is compounded with the first metal plating layer;
- and
- wherein a second part of the base body that is connected to the frame is compounded with a second metal plating layer, and the second metal plating layer is connected to the first metal plating layer.
A middle frame assembly, comprising:
- a middle plate;
- and
- a frame disposed around an outer edge of the middle plate, wherein the middle plate includes a base body comprising first carbon fiber reinforced resin composite material and a first metal plating layer compounded on a surface of the base body;
- wherein a part of the base body that is not connected to the frame is compounded with the first metal plating layer;
- and
- wherein a through hole is provided on the base body, a second metal plating layer is compounded on a surface of the through hole, and the second metal plating layer is connected to the first metal plating layer.
An electronic device comprising a middle frame assembly, wherein the middle frame assembly includes:
- a middle plate;
- and
- a frame disposed around an outer edge of the middle plate, wherein the middle plate includes a base body comprising first carbon fiber reinforced resin composite material and a first metal plating layer compounded on a surface of the base body;
- wherein a first part of the base body that is not connected to the frame is compounded with the first metal plating layer;
- and
- wherein a second part of the base body that is connected to the frame is compounded with a second metal plating layer, and the second metal plating layer is connected to the first metal plating layer.
Dependencies are inferred from the claim text.