Delivering power to semiconductor loads

A method of making electronic assemblies, the method comprising:

• providing an electronic module having electronic circuitry including circuit terminals arranged in a first pattern having a first spacing between the circuit terminals;
• providing an interconnection module having x-input terminals arranged on a first surface of the interconnection module in a pattern configured to align with the first pattern of circuit terminals, and x-output terminals arranged on a second surface in a second pattern configured to align with external terminals of a third electronic device, the second pattern having a second spacing between the x-output terminals, the second spacing being different than the first spacing, the x-input terminals being electrically connected to the x-output terminals;
• assembling the electronic module to the first surface of the interconnection module with each circuit terminal mated with and electrically connected to a respective x-input terminal;
• wherein the interconnection module is configured to provide electrical and mechanical translation between the circuit terminals arranged in the first pattern and the external terminals of the third electronic device arranged in the second pattern;
• wherein the electronic module and the interconnection module are stacked to form a module sandwich including the electronic module in a first layer, electrical connections between the circuit terminals and the x-input terminals in a second layer, and the interconnection module in a third layer;
• assembling a first panel comprising a plurality of unsingulated electronic modules;
• assembling a second panel comprising a plurality of unsingulated interconnection modules;
• wherein the assembling of the electronic module and the interconnection module is performed using the first and second panels prior to singulation to form a panel sandwich and further comprises forming electrical connections between each circuit terminal and each respective x-input terminal;
• cutting the panel sandwich along predetermined cut lines to singulate a plurality of the module sandwiches;
• wherein the assembling of the electronic module and the interconnection module further comprises providing a prepreg layer between the first and second panels and,
• forming electrical connections between each circuit terminal and each respective x-input terminal comprises applying a sinter material between each circuit terminal and each respective x-input terminal.

An apparatus comprising:

• a semiconductor device having power input terminals;
• switching power conversion circuitry including a plurality of conversion cells, each conversion cell including at least one semiconductor device and being electrically connected to one or more converter outputs, the switching power conversion circuitry being configured to convert power received at a first voltage for delivery via the one or more converter outputs at a second lower voltage;
• and
• conductive interconnection layers in a printed circuit board (PCB) or substrate having a plurality of output terminals arranged on one surface of the PCB or substrate in a pattern configured to align with the power input terminals of the semiconductor device, the pattern having a spacing between the output terminals, the output terminals being electrically connected to the one or more converter outputs;
• wherein the conductive interconnection layers are configured to provide electrical and mechanical translation between the converter outputs and the power input terminals of the semiconductor device;
• wherein the switching power conversion circuitry and the conductive interconnection layers are stacked with the switching power conversion circuitry located at a first level, the conductive interconnection layers at a second level and the output terminals at a third level.

A method of powering a semiconductor device having power input terminals, the method comprising:

• providing switching power conversion circuitry including a plurality of conversion cells, each conversion cell including at least one semiconductor device and being electrically connected to one or more converter outputs, the switching power conversion circuitry being configured to convert power received at a first voltage for delivery via the one or more converter outputs at a second lower voltage;
• providing conductive interconnection layers in a printed circuit board (PCB) or substrate having a plurality of input terminals arranged on a first surface, and a plurality of output terminals arranged on a second surface of the PCB or substrate in a pattern configured to align with the power input terminals of the semiconductor device, the pattern having a spacing between the output terminals,
• providing a plurality of conductive pillars for electrically connecting the one or more converter outputs with respective input terminals of the PCB or substrate;
• arranging the PCB or substrate and the switching power conversion circuitry such that the switching power conversion circuitry resides on or above the first surface of the PCB or substrate, with each converter output aligned with and electrically connected to a respective input terminal of the PCB or substrate by a respective one of the conductive pillars;
• wherein the conductive interconnection layers are configured to provide electrical and mechanical translation between the one or more converter outputs and the power input terminals of the semiconductor device;
• wherein the switching power conversion circuitry and the conductive interconnection layers are arranged to form a stack including the switching power conversion circuitry in a first layer, the conductive pillars connecting the one or more converter outputs and the input terminals of the PCB or substrate in a second layer, and the conductive interconnection layers in a third layer;
• and
• wherein the output terminals are arranged with alternating polarities to reduce interconnection inductance.

A method of powering a semiconductor device having power input terminals, the method comprising:

• providing power conversion circuitry arranged in a multi-cell structure having a plurality of conversion cells, the conversion circuitry being configured to convert power received at a first voltage for delivery via the plurality of conversion cells to one or more converter outputs at a second lower voltage;
• providing output terminals configured and arranged on a surface of a printed circuit board or substrate to align with the power input terminals of the semiconductor device;
• providing translation connections electrically connecting respective ones of the output terminals to respective ones of the one or more converter outputs, providing electrical and mechanical translation between the converter outputs and the power input terminals of the semiconductor device;
• providing the power conversion circuitry and the translation connections in one or more assemblies;
• and
• mounting the one or more assemblies to the semiconductor device with the output terminals aligned with and electrically connected to respective ones of the power input terminals to form a stack including the power conversion circuitry in a first layer, the output terminals in a second layer, and the semiconductor device in a third layer.

A method of powering a semiconductor device having power input terminals, the method comprising:

• providing switching power conversion circuitry including a plurality of conversion cells, each conversion cell including at least one semiconductor device and being electrically connected to one or more converter outputs, the conversion circuitry being configured to convert power received at a first voltage for delivery via the one or more converter outputs at a second lower voltage;
• providing conductive interconnection layers in a printed circuit board (PCB) or substrate having input terminals arranged on one surface of the PCB or substrate and output terminals arranged on another surface of the PCB or substrate in a pattern configured to align with the power input terminals of the semiconductor device, the pattern having a spacing between the output terminals;
• providing a motherboard having input terminals arranged on a first side of the motherboard in a pattern configured to align with the converter output terminals, and output terminals arranged on a surface of a second opposite side of the motherboard in a second pattern configured to align with the input terminals on the PCB or substrate;
• arranging the switching power conversion circuitry to the first side of the motherboard, with each converter output mated with and electrically connected to a respective input terminal of the motherboard;
• and
• arranging the conductive interconnection layers to the second side of the motherboard, with each input terminal on the PCB or substrate mated with and electrically connected to a respective output terminal of the motherboard;
• wherein the conductive interconnection layers are configured to provide electrical and mechanical translation between the motherboard output terminals and the power input terminals of the semiconductor device;
• wherein the power conversion circuitry, the motherboard, and the conductive interconnection layers are arranged to form a stack including the power conversion circuitry in a first layer, the motherboard in a second layer, and the conductive interconnection layers in a third layer.

An apparatus comprising:

• a very large scale integrated (VLSI) processor having power input terminals for receiving power to operate the processor at a respective input voltage;
• a power converter comprising a plurality of converter cells;
• each converter cell comprising:
• a magnetically permeable core having a magnetic path, a first winding element and a second winding element, the first winding element and the second winding element each coupling the magnetic path of the magnetically permeable core, and a switch;
• wherein the second winding element and the switch of each converter cell are connected in series between a respective output terminal and a respective common terminal;
• wherein a plurality of the output terminals and common terminals of the converter cells are connected together to form a parallel output structure;
• wherein the VLSI processor is mounted to a first side of a substrate, the VLSI processor has a footprint on the substrate, and the power input terminals of the VLSI processor are located in the footprint and connected to respective output terminals and the common terminals of the converter cells;
• wherein the plurality of converter cells are mounted to the substrate opposite the VLSI processor in the same or similar footprint of the VLSI processor.

An apparatus comprising:

• a very large scale integrated (VLSI) processor having power input terminals for receiving power to operate the processor at a respective input voltage;
• a power converter comprising a plurality of converter cells;
• each converter cell comprising:
• a magnetically permeable core having a magnetic path, a winding element, coupling the magnetic path of the magnetically permeable core, and a switch;
• wherein the winding element and the switch of each converter cell are connected in series between a respective output terminal and a respective common terminal;
• wherein a plurality of the output terminals and common terminals of the converter cells are connected together to form a parallel output structure;
• wherein the VLSI processor is mounted to a first side of a first substrate, the VLSI processor has a footprint on the first substrate, and the power input terminals of the VLSI processor are located in the footprint and connected to respective output terminals and the common terminals of the converter cells;
• wherein the plurality of converter cells are mounted to the first substrate opposite the VLSI processor in the same or similar footprint of the VLSI processor.