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US 12,592,508 B2Granted
Wave spring-based interconnect probes
AssigneeIntel Corporation
InventorsIsmael Franco Núñez, Daqiao Du, Zhen Zhou, Gordon P. Melz
Life of this patent
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Abstract
In one embodiment, an interconnect apparatus (e.g., an interposer apparatus) includes a plurality of interconnect probes that each include a wave spring structure that includes a plurality of stacked wave spring discs. The wave spring discs may be formed in a sinusoidal wave form shape, or in another wave form shape.
Claims21
An interposer apparatus comprising:
- a housing;
- and
- a plurality of interconnect probes positioned within the housing such that opposite ends of the interconnect probe are disposed outside the housing, wherein each interconnect probe comprises a first connector, a second connector, and a wave spring structure comprising a plurality of stacked wave spring discs conductively coupled between the first connector and the second connector, the interconnect probes spaced at a distance less than 0.45 mm.
A system comprising:
- a chip package comprises a first set of electrical contact pads;
- a printed circuit board (PCB) comprising a second set of electrical contact pads;
- and
- an interposer apparatus disposed between the chip package and PCB, the interposer apparatus comprising a plurality of interconnect probes to electrically connect the first set of electrical contact pads and the second set of electrical contact pads, each interconnect probe comprising a wave spring structure comprising a plurality of wave spring discs conductively coupled with one another in a stack, wherein a pitch of the interconnect probes is less than 0.45 mm.
1 more element
Dependencies are inferred from the claim text.