Multiwire plate-enclosed ball-isolated single-substrate silicon-carbide-die package
OwnerNicholas J. Chiolino, A. Matthew Francis +2inventors
InventorsNicholas J. Chiolino, A. Matthew Francis, Matthew W. Barlow, Jacob Kupernik
Life of this patent
Estimating the term…
Abstract
A silicon carbide die package with multiple wire access points utilizing top and bottom enclosure plate clamps housing a silicon carbide die on a printed wiring board with wire contact pads, and a set of set screws providing downward pressure from the top enclosure plate inside the center of a cylindrical isolation housing to an isolation ball positioned above a clamp discs to clamp a wire end between the clamp disc and the wire contact pad.
Claims11
An electrical circuit packaging apparatus for connecting a wire with a wire end to a package die, the electrical circuit packaging apparatus comprising:
- an enclosure top plate connected to an enclosure bottom plate with a wiring board captured between the enclosure top plate and the enclosure bottom plate;
- the wiring board including a wire contact pad;
- an adjustable clamping pressure extension connected to the enclosure top plate, the adjustable clamping pressure extension including a pressure end;
- a compressive fabric positioned between the pressure end and the wire contact pad;
- and
- an insulating guidance housing with a housing body including an outer housing wall defining a vertical through aperture sized to accept the pressure end and the compressive fabric, the insulating guidance housing positioned above the wire contact pad;
- the housing body further defining a side wire aperture to position the wire end between the wire contact pad and the pressure end.
An electrical circuit packaging apparatus for connecting a wire with a wire end to a package die, the electrical circuit packaging apparatus comprising:
- an enclosure top plate connected to an enclosure bottom plate with a wiring board captured between the enclosure top plate and the enclosure bottom plate;
- the wiring board including a wire contact pad;
- an adjustable clamping pressure extension connected to the enclosure top plate, the adjustable clamping pressure extension including a pressure end;
- an clamp disc;
- a compressive fabric;
- an insulating guidance housing with a housing body including an outer housing wall defining a vertical through aperture sized to accept the pressure end, the clamp disc, and the compressive fabric, the insulating guidance housing positioned above the wire contact pad;
- the housing body further defining a side wire aperture to position the wire end between the wire contact pad and the clamp disc.
An electrical circuit packaging apparatus for connecting a wire with a wire end to a package die, the electrical circuit packaging apparatus comprising:
- an enclosure top plate connected to an enclosure bottom plate with a wiring board captured between the enclosure top plate and the enclosure bottom plate;
- at least one enclosure post threadably engaging an enclosure nut to connect the enclosure top plate and enclosure bottom plate,
- the enclosure post and enclosure nut having a matching coefficient of thermal expansion;
- the wiring board including a wire contact pad;
- an adjustable clamping pressure extension connected to the enclosure top plate, the adjustable clamping pressure extension including a pressure end;
- an insulating guidance housing with a housing body including an outer housing wall defining a vertical through aperture, the insulating guidance housing positioned above the wire contact pad;
- the housing body further defining a side wire aperture to position the wire end between the wire contact pad and the pressure end.
Dependencies are inferred from the claim text.