Deformable conductive structures and methods for fabrication

A conductive assembly comprising:

• a deformable substrate having major surface;
• and
• a deformable conductor arranged on the major surface deformable substrate, the deformable conductor comprising a conductive liquid or gel;
• wherein the deformable substrate forms a spiral cross-section with the deformable conductor to enclose the deformable conductor with the deformable substrate;
• wherein the deformable conductor is a first deformable conductor and further comprising a second deformable conductor positioned on the substrate and spaced apart from the first deformable conductor;
• and
• wherein the deformable substrate, the first deformable conductor, and the second deformable conductor are arranged to form a coaxial transmission line.

A method of fabricating a deformable conductive assembly, the method comprising:

• arranging a first deformable conductor on a first major surface of a deformable substrate,
• wherein the deformable conductor comprises a conductive liquid or gel;
• and
• manipulating the deformable substrate along an axis to enclose the deformable conductor,
• arranging a second deformable conductor spaced apart from the first deformable conductor such that the deformable substrate forms a dielectric between the first and second deformable conductors;
• and
• wherein the deformable substrate has a second major surface opposite the first major surface, and wherein the second deformable conductor is positioned on the second major surface.