Multilayer electronic component

A multilayer electronic component comprising:

• a body including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction and including a dielectric layer and internal electrodes alternately disposed with the dielectric layer interposed therebetween in the first direction;
• and
• external electrodes disposed on the third and fourth surfaces,
• wherein the external electrodes include an electrode layer disposed on the body and a conductive resin layer directly disposed on the electrode layer, and the electrode layer being a single layer,
• the external electrodes include connection portions disposed on the third surface and the fourth surface and band portions extending from the connection portions to the first and second surfaces,
• the electrode layer includes a first conductive metal and glass,
• the conductive resin layer includes a second conductive metal and a resin, and the second conductive metal includes at least one selected from the group consisting of Ni, Cu, Pd, Ag, Au, Pt, Sn, W and Ti,
• an average thickness of the conductive resin layer at the connection portion is less than 13 μm, and
• an average thickness of the conductive resin layer at the band portion exceeds 9.43 μm, and
• a maximum thickness of the electrode layer at the connection portion is thicker than a maximum thickness of the conductive resin layer at the connection portion.