Laminated common mode filter
AssigneeAmotech Co., Ltd.
InventorsByungguk Lim, Heehwang Kim
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Abstract
Proposed is a laminated common mode filter in which a ground pattern is interposed between coil patterns to form additional capacitance. The proposed laminated common mode filter comprises: an upper electrode layer composed of a laminate having a first coil pattern, a second coil pattern, and a third coil pattern; a ground layer that is arranged on the lower portion of the upper electrode layer and has a ground pattern; and a lower electrode layer that is arranged on the lower portion of the ground layer and is composed of a laminate having a fourth coil pattern, a fifth coil pattern, and a sixth coil pattern, wherein the ground pattern is arranged to overlap the coil patterns of the upper electrode layer and the coil patterns of the lower electrode layer to form capacitance.
Claims12
A laminated common mode filter comprising:
- an upper electrode layer constructed as a stack body in which a first coil pattern, a second coil pattern, and a third coil pattern have been formed;
- a ground layer disposed under the upper electrode layer and having a ground pattern formed thereon;
- and
- a lower electrode layer constructed as a stack body in which a fourth coil pattern, a fifth coil pattern, and a sixth coil pattern have been formed and disposed under the ground layer,
- wherein the ground pattern is disposed to overlap the coil pattern of the upper electrode layer and the coil pattern of the lower electrode layer and configured to form capacitance, and
- wherein the first coil pattern is disposed in a layer different from a layer of the second coil pattern and the third coil pattern, and the second coil pattern and the third coil pattern are alternately disposed in an identical layer on the basis of a vertical section of the upper electrode layer.
A laminated common mode filter comprising:
- a first sheet;
- a first coil pattern disposed on a first surface of the first sheet;
- a second sheet disposed on a lower surface of the first sheet;
- a second coil pattern disposed on a first surface of the second sheet and interposed between the first sheet and the second sheet;
- a third coil pattern disposed on the first surface of the second sheet, interposed between the first sheet and the second sheet, and spaced apart from the second coil pattern;
- a third sheet disposed on a lower surface of the second sheet;
- a ground pattern disposed on a first surface of the third sheet, interposed between the second sheet and the third sheet, and disposed to overlap the first coil pattern, the second coil pattern, and the third coil pattern;
- a fourth sheet disposed on a lower surface of the third sheet;
- a fourth coil pattern disposed on a first surface of the fourth sheet, interposed between the third sheet and the fourth sheet, configured to construct a first coil by being connected to the first coil pattern through a via hole, and disposed to overlap the first coil pattern and the ground pattern;
- a fifth sheet disposed on a lower surface of the fourth sheet;
- a fifth coil pattern disposed on a first surface of the fifth sheet, interposed between the fourth sheet and the fifth sheet, configured to construct a second coil by being connected to the second coil pattern through a via hole, and disposed to overlap the second coil pattern and the ground pattern;
- and
- a sixth coil pattern disposed to be spaced apart from the fifth coil pattern on the first surface of the fifth sheet, interposed between the fourth sheet and the fifth sheet, configured to construct a third coil by being connected to the third coil pattern through a via hole, and disposed to overlap the third coil pattern and the ground pattern.
Dependencies are inferred from the claim text.