Lane repair and lane reversal implementation for die-to-die (D2D) interconnects

A method comprising:

• identifying, via physical layer circuitry of a first die of a package comprising the first die and a second die and an interconnect that couples the first die and the second die, a failure in a first physical data lane of a first plurality of physical data lanes of a mainband of the interconnect, the interconnect comprising the mainband and a sideband;
• in response to identifying the failure, remapping, via the physical layer circuitry of the first die, first data traffic of a first logical data lane onto a second physical data lane of the mainband;
• communicating information regarding the remapping to the second die via the sideband;
• providing the first data traffic of the first logical data lane to a first multiplexer of the first die;
• and
• controlling, via the physical layer circuitry of the first die, the first multiplexer to provide the first data traffic to a second transmitter of the first die associated with the second physical data lane.

A package comprising:

• a first die comprising a central processing unit (CPU) and a protocol stack comprising:
• a die-to-die adapter to communicate with protocol layer circuitry via a flit-aware die-to-die interface (FDI) and physical layer circuitry via a raw die-to-die interface (RDI), wherein the die-to-die adapter is to communicate message information, the message information comprising first information of a first interconnect protocol;
• and
• the physical layer circuitry coupled to the die-to-die adapter via the RDI, wherein the physical layer circuitry is to receive and output the first information to a second die via an interconnect,
• wherein the physical layer circuitry comprises:
• a first plurality of receivers to receive data via a first plurality of physical data lanes;
• and
• at least one redundant receiver, wherein the physical layer circuitry is to shift data traffic of a first plurality of physical data lanes to adjacent ones of the first plurality of physical data lanes and at least one redundant lane associated with the at least one redundant receiver, in response to a lane failure in a first physical lane of the first plurality of physical data lanes;
• and
• the second die coupled to the first die via the interconnect.