Thermal management system for an information handling system

An information handling system, comprising:

• a processor;
• memory media storing instructions executable by the processor to perform operations;
• a thermal management system, including:
• a fan including:
• a fan housing;
• an impeller coupled to the fan housing;
• a fin stack coupled to the fan;
• a heat pipe having a first end and a second end opposite to the first end, the heat pipe in thermal communication with a computing element at the first end of the heat pipe;
• and
• a vapor chamber coupled to the fan housing, the vapor chamber and the fan housing encasing the impeller, the vapor chamber coupled to the second end of the heat pipe, the vapor chamber in fluid communication with the heat pipe, the vapor chamber including:
• a first region in superimposition with the fan housing;
• a second region extending from the first region and spaced-apart from the fan housing, the second region including:
• a first side;
• a second side opposite to the first side, the second side facing a printed circuit board, the second side including:
• a thermal pad in thermal communication with an additional computing component that is positioned on the PCB adjacent to the second region and spaced-apart from the fan,
• wherein the heat pipe is configured to transfer thermal energy from the computing element at the first end of the heat pipe to the second end of the heat pipe such that the thermal energy is transferred to the vapor chamber, wherein the impeller transfers the thermal energy at the vapor chamber to the fin stack.