Semiconductor device tester
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsTing-Yu Chiu, Yi-Neng Chang, Shin-Han You, Chien Fang Huang
Life of this patent
Estimating the term…
Abstract
A test system and method of testing are provided. In some embodiments, a system for testing an integrated circuit package includes a device tester. The device tester includes a socket, a cylinder head unit engageable with the socket, and a pressure regulator. The socket includes a first pressure cylinder configured to engage a first region of the integrated circuit package and a second pressure cylinder configured to engage a second region of the integrated circuit package. The pressure regulator is configured to provide at gas at a first pressure to the first pressure cylinder and to provide the gas at a second pressure different than the first pressure to the second pressure cylinder.
Claims20
A system for testing an integrated circuit package, comprising:
- a device tester, comprising:
- a socket;
- a cylinder head unit engageable with the socket, comprising:
- a first pressure cylinder configured to engage a first region of the integrated circuit package;
- and
- a second pressure cylinder configured to engage a second region of the integrated circuit package;
- a pressure regulator configured to provide a gas at a first pressure to the first pressure cylinder and to provide the gas at a second pressure different than the first pressure to the second pressure cylinder;
- a first gas inlet connected between the pressure regulator and the cylinder head unit;
- and
- a second gas inlet connected between the pressure regulator and the cylinder head unit, wherein the gas comprises at least one of air or an inert gas.
A method, comprising:
- interfacing an integrated circuit package in a socket of a device tester;
- providing a first pressure to a first pressure cylinder to apply a first force to a first region of the integrated circuit package using the first pressure cylinder;
- providing a second pressure to a second pressure cylinder to apply a second force different than the first force to a second region of the integrated circuit package using the second pressure cylinder;
- providing the first pressure to a third pressure cylinder to apply a third force to a third region of the integrated circuit package;
- and
- performing a first test of the integrated circuit package using the device tester.
A system, comprising:
- a socket;
- a cylinder head unit engageable with the socket, comprising:
- a first pressure cylinder configured to engage a first region of an integrated circuit package;
- a second pressure cylinder configured to engage a second region of the integrated circuit package;
- a third pressure cylinder configured to engage a third region of the integrated circuit package;
- a first pressure cavity in fluid communication with the first pressure cylinder;
- and
- a second pressure cavity in fluid communication with the second pressure cylinder and the third pressure cylinder;
- and
- a pressure regulator configured to provide a first pressure to the first pressure cavity and a second pressure different than the first pressure to the second pressure cavity.
Dependencies are inferred from the claim text.