Testing elements for bonded structures
AssigneeAdeia Semiconductor Bonding Technologies Inc.
InventorsBelgacem Haba, Christopher Aubuchon
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Abstract
A bonded structure for testing a semiconductor device and a method for testing semiconductor devices is disclosed. The bonded structure may comprise a testing element and one or more semiconductor element. The testing element may comprise a testing circuitry. The testing element may be bonded to a semiconductor device or embedded within a semiconductor device. The testing element may be configured to test the semiconductor device. The testing element may be configured to test a first semiconductor device to which it is bonded as well as other semiconductor devices bonded to the first semiconductor device.
Claims25
A bonded structure comprising;
- a first semiconductor element comprising a first active circuitry;
- and
- a testing element comprising a testing circuitry, the testing element directly bonded to the first semiconductor element without an adhesive along a bonding interface;
- wherein the testing circuitry is configured to test functionality of at least a portion of the first active circuitry of the first semiconductor element during operation of the bonded structure by transmitting one or more signals to the first active circuitry and receiving a return signal emitted by the tested active circuitry, wherein the one or more signals probe the one or more portions of the first active circuitry;
- and
- wherein the testing circuitry processes the received return signal during operation of the bonded structure to determine whether the tested active circuitry of the first semiconductor element is functional or non-functional.
A bonded structure comprising;
- a first semiconductor element comprising a testing circuitry;
- and
- a second semiconductor element directly bonded to the first semiconductor element without an adhesive along a bonding interface, the second semiconductor element comprising a first active circuitry;
- wherein the testing circuitry is configured to test functionality of at least a portion of the first active circuitry of the second semiconductor element.
A bonded structure comprising:
- a first semiconductor element comprising a first active circuitry;
- a first nonconductive bonding layer of the first semiconductor element at least partially defining a direct bonding surface of the bonded structure;
- and
- one or more traces connected to the first active circuitry and extending at least partially into the first nonconductive bonding layer, wherein the one or more traces is configured to provide electrical communication between the first active circuitry and a testing element, the one or more traces terminating at or below the direct bonding surface.
Dependencies are inferred from the claim text.