Cantilever probe card device and solder receiving probe

A cantilever probe card device, comprising:

• a substrate including a plurality of soldering pads;
• a plurality of solders respectively disposed on the soldering pads;
• and
• a plurality of solder receiving probes fixed onto the substrate and each including:
• an arm segment;
• a main segment located at one side of the arm segment, wherein the main segment has a soldering end portion and an extending end portion respectively located at two opposite sides thereof along a predetermined direction, wherein the main segment has a plurality of solder receiving holes penetrating therethrough, and wherein the solder receiving holes are arranged along a top edge of the soldering end portion and are arranged in one row along an extending direction perpendicular to the predetermined direction;
• and
• a testing segment having an upright shape along the predetermined direction and connected to another side of the arm segment;
• wherein the main segment of each of the solder receiving probes has a plurality of inner supporting arms;
• and wherein, in each of the solder receiving probes, any one of the inner supporting arms is arranged between two of the solder receiving holes adjacent to each other, and a width of any one of the inner supporting arms along the extending direction is less than an inner diameter of any one of the solder receiving holes along the extending direction;
• wherein the soldering end portions of the main segments of the solder receiving probes are respectively soldered and fixed onto the soldering pads of the substrate through the solders;
• and wherein, in each of the solder receiving probes, each of the solder receiving holes is able to receive the corresponding solder on the soldering end portion, so that the corresponding solder does not climb across the solder receiving holes arranged in one row along the predetermined direction.