Opto-electrical probe card platform for wafer-level testing of optical mems structures

An apparatus, comprising:

• an electrical probe card comprising a plurality of alignment needles configured to align the electrical probe card with an optical micro-electro-mechanical systems (MEMS) structure on a wafer during testing of the optical MEMS structure, the electrical probe card further comprising a plurality of electrical needles configured to test the optical MEMS structure;
• an optical head configured to direct input light towards the optical MEMS structure through the electrical probe card;
• an optical positioner attached to the electrical probe card and configured to align the optical head with an optical input of the optical MEMS structure;
• an optical alignment stage attached to the electrical probe card, the optical alignment stage comprising a positioner holder attached to the optical positioner configured to support the optical positioner above the electrical probe card;
• a camera configured to obtain at least one image indicating a current alignment of the optical head with the plurality of alignment needles or the optical input of the optical MEMS structure;
• and
• a processor configured to process the at least one image and generate alignment assistance data to assist in alignment of the optical head using the optical positioner.