Cooling system with intermediate chamber

A cooling system of a heating, ventilation, air conditioning, and refrigeration (HVAC&R) system, comprising:

• a heat rejection system;
• and
• an enclosure defining a fluid chamber configured to contain a fluid therein, wherein the enclosure comprises:
• a first surface configured to be in thermal communication with an electronic component of the HVAC&R system coupled to the enclosure, wherein the first surface is configured to transfer thermal energy from the electronic component to the fluid to vaporize the fluid within the enclosure;
• a second surface in thermal communication with the heat rejection system, wherein the second surface is configured to transfer thermal energy from the fluid to the heat rejection system to condense the fluid within the enclosure;
• and
• a third surface opposite the second surface relative to the fluid chamber, wherein the third surface is angled toward the second surface to direct fluid vaporized in the fluid chamber from the first surface toward the second surface.

A heating, ventilation, air conditioning, and refrigeration (HVAC&R) system, comprising:

• an electronic component of the HVAC&R system configured to generate heat during operation of the HVAC&R system;
• and
• a cooling system coupled to the electronic component, wherein the cooling system comprises:
• an enclosure defining a fluid chamber configured to contain liquid fluid;
• an evaporating surface of the enclosure in thermal communication with the electronic component, wherein the evaporating surface is configured to transfer thermal energy from the electronic component to the liquid fluid in the fluid chamber to vaporize the liquid fluid into a vapor fluid;
• a condensing surface of the enclosure configured to be in thermal communication with a heat rejection system of the cooling system, wherein the condensing surface is configured to transfer thermal energy from the vapor fluid to the heat rejection system to condense the vapor fluid into the liquid fluid;
• and
• a baffle disposed within the enclosure and configured to direct the vapor fluid from the evaporating surface toward the condensing surface, wherein the baffle is sloped at a downward angle toward the condensing surface.