Methods and apparatus for processing a substrate
AssigneeApplied Materials, Inc.
InventorsYaoying Zhong, Siew Kit Hoi, John Klocke, Bridger Earl Hoerner
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Abstract
Methods and apparatus for processing a substrate are provided herein. For example, a method comprises in a process chamber, processing a substrate in a presence of an electric field, subsequently capturing an image of the substrate, determining whether substrate arcing occurred based upon analysis of the captured image, and one of continuing processing of the substrate when no arcing is determined or stopping processing of the substrate when arcing is determined.
Claims19
A method for processing a substrate, comprising:
- in a process chamber, processing a substrate in a presence of an electric field;
- subsequently capturing an image of the substrate, wherein capturing the image of the substrate is performed adjacent a slit valve of a deposition chamber configured for processing the substrate;
- comparing the captured image to a baseline image of a substrate arcing pattern of a maximum amount of acceptable arcing;
- determining that substrate arcing occurred and is less than the maximum amount of acceptable arcing based upon the comparison of the captured image;
- and
- continuing processing of the substrate when arcing is determined to be less than the maximum amount of acceptable arcing.
A non-transitory computer readable storage medium having instructions stored thereon that when executed by a processor perform a method for processing a substrate, comprising:
- in a process chamber, processing a substrate in a presence of an electric field;
- subsequently capturing an image of the substrate, wherein capturing the image of the substrate is performed adjacent a slit valve of a deposition chamber configured for processing the substrate;
- comparing the captured image to a baseline image of a substrate arcing pattern of a maximum amount of acceptable arcing;
- determining that substrate arcing occurred and is less than the maximum amount of acceptable arcing based upon analysis the comparison of the captured image;
- and
- continuing processing of the substrate when arcing is determined to be less than the maximum amount of acceptable arcing.
An apparatus for processing a substrate, comprising:
- a process chamber configured to process a substrate in a presence of an electric field;
- an apparatus for capturing an image of the substrate, wherein capturing the image of the substrate is performed adjacent a slit valve of a deposition chamber configured for processing the substrate, wherein the apparatus for capturing the image of the substrate is at least one of a camera or a sensor;
- and
- a controller configured to:
- compare the captured image to a baseline image of a substrate arcing pattern of a maximum amount of acceptable arcing;
- determine that substrate arcing occurred and is less than the maximum amount of acceptable arcing based upon the comparison of the captured image;
- and
- continue to process the substrate when no arcing is determined arcing is determined to be less than the maximum amount of acceptable arcing.
Dependencies are inferred from the claim text.