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US 12,590,225 B2Granted
Polishing composition, polishing method, and method for producing polished substrate
AssigneeFujimi Incorporated
InventorsShota Suzuki, Jingzhi Chen
Life of this patent
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Abstract
According to the present invention, a moderately high polishing speed for a specific material and appropriate ratio of polishing speeds between two or more different materials are achieved in polishing using a polishing composition. The present invention relates to a polishing composition comprising abrasive grains, a water-soluble polymer having no alcoholic hydroxyl group in a side chain, a polyvalent carboxylic acid (salt), and an oxidizing agent, and having a pH of less than 6.
Claims5
A polishing composition comprising:
- abrasive grains consisting of silica abrasive grains with organic acid immobilized on its surface;
- polypropylene glycol present in the polishing composition at a concentration of 2 g/L or higher;
- a water-soluble polymer having an alcoholic hydroxyl group in a side chain present in the polishing composition at a concentration of 1 g/L or lower, wherein the water-soluble polymer having an alcoholic hydroxyl group in a side chain consist of at least one selected from the group consisting of polyvinyl alcohol and a sulfonic acid-modified polyvinyl alcohol;
- a polyvalent carboxylic acid (salt) containing a salt of a polyvalent carboxylic acid and the salt of the polyvalent carboxylic acid consists of a salt of citric acid;
- and
- hydrogen peroxide, and
- having a pH of 2.5 or more and 4 or less.
4 more elements
Dependencies are inferred from the claim text.