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US 12,590,224 B2Granted
Chemical mechanical polishing compositions and methods of use thereof
AssigneeFujifilm Electronic Materials U.S.A., Inc.
InventorsYannan Liang, Bin Hu, Ting-Kai Huang, Shu-Wei Chang, Liqing (Richard) Wen
Life of this patent
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Abstract
A polishing composition includes at least one abrasive, at least one organic acid, at least one anionic surfactant comprising at least a phosphate, at least one phosphonic acid compound having a molecular weight below 500 g/mol, at least one azole containing compound, at least one alkylamine compound having a 6-24 carbon alkyl chain, and an aqueous solvent, and optionally, a pH adjuster.
Claims13
A polishing composition comprising:
- at least one abrasive;
- at least one organic acid;
- at least one anionic surfactant comprising at least a phosphate, and at least one of a hydrophobic 6 to 24 carbon alkyl chain and 2 to 16 ethylene oxide groups, wherein the anionic surfactant is in an amount of from about 0.001% to about 0.1% by weight of the composition;
- at least one phosphonic acid compound having a molecular weight below 500 g/mol, wherein the at least one phosphonic acid is selected from the group consisting of phenylphosphonic acid, butylphosphonic acid, hexylphosphonic acid, benzylphosphonic acid, and mixtures thereof, wherein the phosphonic acid compound is in an amount of from about 0.05% to about 1% by weight of the composition;
- at least one azole containing compound;
- at least one alkylamine compound having a 10-24 carbon alkyl chain, wherein the alkylamine compound is in an amount of from about 0.001% to about 0.1% by weight of the composition;
- and
- an aqueous solvent;
- optionally, a pH adjuster.
6 more elements
A polishing composition comprising:
- at least one abrasive in an amount of from about 0.1% to about 12% by weight of the composition;
- at least two organic acids, in an amount of from about 0.001% to about 2.5% by weight of the composition, wherein at least one of the organic acids is an amino acid;
- at least one anionic surfactant comprising at least a phosphate, and at least one of a hydrophobic 6 to 24 carbon alkyl chain and 2 to 16 ethylene oxide groups, wherein the anionic surfactant is in an amount of from about 0.001% to about 0.1% by weight of the composition;
- at least one phosphonic acid compound having a molecular weight below 500 g/mol in an amount of from about 0.05% to about 1% by weight of the composition;
- at least one azole containing compound in an amount of from about 0.01% to about 0.5% by weight of the composition;
- at least one alkylamine compound having a 10-24 carbon alkyl chain in an amount of from about 0.001% to about 0.1% by weight of the composition;
- and
- an aqueous solvent;
- wherein the pH of the composition is between about 7 to about 12.
6 more elements
Dependencies are inferred from the claim text.